Diamond grinding tools for machining wafers (silicon) in the microchip industry. For an optimum result we recommend grinding tools with diamond in resin and vitrified bonding systems.

Grinding tools exclusively with diamond in electroplated bond systems.

Diamond grinding tools with cushioning plastic core system for machining very hard materials and technical ceramic components. Straight diamond grinding tools in vitrified bond for the machining of ceramic components require special damping, thus VIBSTAR is only available in certain dimensions on request.

Elastic-bonded grinding and polishing tools for the machining of precision components. These are mainly used for precision mechanics in the watchmaking, spectacle and jewellery industries. Our ELASTIC grinding tools were adapted for diverse applications and are used in the deburring, effect grinding, fine grinding and polishing of precision components.

Fine grinding, removal and pre-polishing of silicon carbide in resinoid bond.

Elastic grinding tools in resinoid bond.

Machining of ceramic insert cups in wet grinding (oil).

Machining of steel hip joints in wet grinding using honing sleeves.

Resin-bonded grinding tools for the pointing of hypodermic needles.

The STARTEC XP-F product line from TYROLIT provides innovative polishing wheels for the cost-efficient polishing of the functional surfaces of shank tools. These tools feature a new resinoid bond with a high wear resistance combined with tailored micro-diamonds. These new specifications can also be produced in customer-specific shapes and dimensions. They guarantee the best surface finish while at the same time delivering maximum precision for the polished tools. Show more Show less

The product assortment for backgrinding of wafers allows to reach highest quality surfaces with a significant improved Die Strength Ratio. The composition of optimized diamond quality, special bond system and an unique core design produced with an innovative production technology at Asahi, guarantees lowest grinding forces during the grinding process. In combination with specific process adjustments an outstanding economic efficiency can be reached. Show more Show less